System on Package
By Tummala, Rao
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.


DOI: 10.1036/0071459065

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Author Biography

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.


System on Package
Author(s): Tummala, Rao
ISBN: 0071459065
DOI: 10.1036/0071459065

Format: hardcover, 785 pages.
Pub date: 15 Apr 2008
Copyright: 2008
$125.00 US
Product Line: McGraw-Hill Professional

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