Failure-Free Integrated Circuit Packages
By Cohn, Charles and Harper, Charles A.
SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE

Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques.

Failure-Free Integrated Circuit Packages helps you:

* Find, identify, and correct potential failures before they occur
* Improve device reliability
* Learn from case studies of IC package failure modes
* Quickly locate failures through visual comparisons
* Apply state-of-the-art failure analysis techniques
* Comprehend the physics behind the failure mechanism
* Understand the limitations of reliability testing and lifetime estimation

INSIDE, YOU’LL FIND A PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs IN ORGANIC PACKAGES. AREAS COVERED INCLUDE:
Fundamentals of IC package technologies
Reliability
Physics and chemistry of failures in packaged devices
Strategies for locating failures
Failure analysis techniques
Failure modes common in organic IC packages
Emerging assembly materials for IC packaging


DOI: 10.1036/0071434844

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Author Biography

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.


Failure-Free Integrated Circuit Packages
Author(s): Cohn, Charles and Harper, Charles A.
ISBN: 0071434844
DOI: 10.1036/0071434844

Format: hardcover, 366 pages.
Pub date: 27 Jul 2004
Copyright: 2004
$99.50 US
Product Line: McGraw-Hill Professional

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