Fundamentals of Microsystems Packaging
By Tummala, Rao
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP

Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:


*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing


DOI: 10.1036/0071418075

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Author Biography

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.


Fundamentals of Microsystems Packaging
Author(s): Tummala, Rao
ISBN: 0071418075
DOI: 10.1036/0071418075

Format: eBook, 967 pages.
Pub date: 8 May 2001
Copyright: 2001
$89.95 US
Product Line: McGraw-Hill Professional

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